2,2-Bis(4-hydroxy-3,5-dimethylphenyl)propane CAS 5613-46-7

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Product Name: 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane

Synonyms: TMBPA; 4,4′-Isopropylidenebis(2,6-dimethylphenol); 4,4′-Isopropylidenedi-2,6-xylenol; Bisxylenol A; NSC 73730; Tetramethylbisphenol A
CAS No: 5613-46-7
Molecular Formula: C19H24O2

预计送达： 周六, 8 月 23 – 周三, 8 月 27

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2,2-Bis(4-hydroxy-3,5-dimethylphenyl)propane (CAS 5613-46-7) Comprehensive Product Guide

Product Overview & Specifications
Key Industrial Applications
Usage Guidelines
Industry Case Studies
Technical Consultation & Quotation

Product Overview & Specifications

Parameter	Specification	Bisphenol A	Bisphenol F
CAS Number	5613-46-7	80-05-7	620-92-8
Molecular Formula	C19H24O2	C15H16O2	C13H12O2
Molecular Weight	284.39 g/mol	228.29 g/mol	200.23 g/mol
Melting Point	155-158°C	158-159°C	80-85°C
Thermal Stability	Up to 300°C	280°C	260°C

Key Industrial Applications

1. High-Performance Polymer Additives

Primary functions in epoxy resins/polycarbonates:

Thermal stabilizer for automotive under-hood components
Oxidation resistance enhancer in aerospace composites
Cross-linking agent for high-voltage insulation materials

2. Specialty Chemical Intermediate

Synthesis of flame-retardant additives (e.g., phosphorous-containing derivatives)
Production of advanced polyarylates for medical devices

Usage Guidelines

Application	Recommended Ratio	Processing Temp
Epoxy Formulations	0.5-1.5% wt	120-150°C
Polycarbonate Blends	0.8-2.0% wt	240-280°C
Adhesive Systems	1.0-3.0% wt	80-110°C

Industry Case Studies

Case 1: Automotive Lighting Systems

Client: Tier-1 German automotive supplier
Challenge: Headlight reflector degradation at 120°C+
Solution: 1.2% additive in polycarbonate blend
Result: 40% improvement in thermal aging resistance

Case 2: Electronic Encapsulants

Client: Japanese semiconductor manufacturer
Challenge: Ionic contamination in potting compounds
Solution: Modified phenolic hardener system
Result: Achieved Class III electronic reliability standards